issue 4 - may 2007 1 www.zetex.com ? zetex semiconductors plc 2007 package information - SOT23 surface mounted, 3 pin package package outline note: controlling dimensions are in millimeters. ap proximate dimensions are provided in inches soldering footprint dim. millimeters inches dim. millimeters inches min. max. min. max. min. max. min. max. a - 1.12 - 0.044 e1 1.90 nom 0.075 nom a1 0.01 0.10 0.0004 0.004 e 2.10 2.64 0.083 0.104 b 0.30 0.50 0.012 0.020 e1 1.20 1.40 0.047 0.055 c 0.085 0.20 0.003 0.008 l 0.25 0.60 0.0098 0.0236 d 2.80 3.04 0.110 0.120 l1 0.45 0.62 0.018 0.024 e0.95 nom0.037 nom----- e e l e1 d a c e1 l1 a1 b 3 leads mm inches 0.8 0.031 0.9 0.035 0.95 0.037 2.0 0.079 www.datasheet.net/ datasheet pdf - http://www..co.kr/
package information - SOT23 issue 4 - may 2007 2 www.zetex.com ? zetex semiconductors plc 2007 nominal weight nominal weight per device 8mg. tape and reel information embossed carrier tape configuration orientation tape width (mm) reel size (inches) no. of components tape option indicator 8 7 3,000 ta 8 13 10,000 tc dimensions mm (inches) tape size (mm) 8 121624 a0, b0, k0 see note * notes: * a0, b0 and k0 dimensions are determined with respect to eia/jedec rotational and lateral movement requirements (see fig. 1). see note * see note * see note * b1 (max.) 4.55 (0.179) 8.20 (0.323) 12.10 (0.476) 20.10 (0.791) d 1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00 d1 (max.) 1.00 (0.039) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) e 1.75 0.10 1.75 0.10 1.75 0.10 1.75 0.10 f 3.50 0.10 (0.138 0.004) 5.50 0.05 (0.217 0.002) 7.50 0.10 (0.295 0.004) 11.50 0.10 (0.453 0.004) p 4.00 0.10 (0.157 0.004) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 4.00 0.10 (0.157 0.004) to 20.00 0.10 (0.787 0.004) in 4.00 (0.157) increments p0 4.00 0.10 4.00 0.10 4.00 0.10 4.00 0.10 p2 2.00 0.05 2.00 0.05 2.00 0.05 2.00 0.05 t (max.) 0.40 0.40 0.40 0.40 w 8.00 (0.315) 12.00 0.30 (0.472 0.012) 16.30 (0.642) 24.30 (0.957) d k t p0 p2 a0 b0 p center lines of cavity 10 pitches culmulative tolerance on tape 0.2mm (0.008?) user direction of feed embossment top cover tape k0 b1 see note 1 see note 1 see note 1 d1 w f e www.datasheet.net/ datasheet pdf - http://www..co.kr/
package information - SOT23 issue 4 - may 2007 3 www.zetex.com ? zetex semiconductors plc 2007 this publication is issued to provide outline information only whic h (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. the company reserves the right to alter without notice the specif ication, design, price or conditions of supply of any product or service. figure 1 - rotational and lateral movement reel configuration tape option a max. b min. c d min. n min. ta 179 (7.047) 1.5 (0.06) 13.00 - 13.02 (0.512 - 0.52) 25.0 (0.984) 50 (1.969) tc 330 (12.992) 20.2 (0.795) tape size g t m ax. 8mm 8.4 -9.9 (0.33 - 0.39) 14.4 (0.567) 12mm 12.4 -16.4 (0.49 - 0.569) 18.4 (0.724) 16mm 16.4 -18.4 (0.65 - 0.729 ) 22.4 (0.882) 24mm 24.4 - 26.4 (0.96 ? 1.039) 30.4 (1.197) 20 maximum 0.5mm maximum 0.5mm maximum sketch a (top view) component lateral movement component cavity center line 20 maximum component center line b0 a0 sketch c (top view) component rotation - top view sketch b (side or front sectional view) component rotation - side view full radius tape slot in core for tape start. 2.5mm min. width, 10mm min. depth g t n c d a b www.datasheet.net/ datasheet pdf - http://www..co.kr/
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